Meta-Stable Conditions of Diffusion Brazing

Journal title

Archives of Metallurgy and Materials




No 2 June


Divisions of PAS

Nauki Techniczne


Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Commitee on Metallurgy of Polish Academy of Sciences




DOI: 10.2478/v10172-011-0035-7 ; ISSN 1733-3490


Tuah-Poku I. (1988), A Study of the Transient Liquid Phase Bonding Process Applied to a Ag/Cu/Ag Sandwich Joint, Metallurgical Transactions, 19A, 675. ; Kloch J. (2005), Morphological Characteristics of the Multi-layer/Substrate Systems, null, 375. ; Wołczyński W. (2006), Mass Transport during Diffusion Soldering or Brazing at the Constant Temperature, null, 12. ; Chuang Y. (1975), Kinetics of Diffusion Controlled Peritectic Reaction during Solidification of Iron-Carbon Alloys, Metallurgical Transactions, 6, A, 235. ; Jacobson D. (1992), Diffusion Soldering, Soldering & Surface Mount Technology, 10, 27, ; Jiangwei R. (2002), Microstructure Characteristics in the Interface Zone of Ti/Al Diffusion Bonding, Materials Letters, 56, 647, ; Wołczyński W. (2006), Segregation Profiles in Diffusion Soldered Ni/Al/Ni Interconnections, Materials Science Forum, 508, 385, ; D. Kopyciński, Krystalizacja faz międzymetalicznych i cynku na żelazie oraz jego nisko- i wysokowęglowych stopach podczas procesu cynkowania. Monografia AGH, 149, Kraków 2006, 131 stron. ; Umeda T. (1996), Phase Selection during Solidification of Peritectic Alloys, Acta Materialia, 44, 4209, ; MacDonald W. (1998), Isothermal Solidification Kinetics of Diffusion Brazing, Metallurgical and Materials Transactions, 29A, 315, ; Phelan D. (2006), Kinetics of the Peritectic Phase Transformation: In-situ Measurements and Phase Field Modelling, Metallurgical/Materials Transactions, 37A, 985,